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Near-infrared heating device - List of Manufacturers, Suppliers, Companies and Products

Near-infrared heating device Product List

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Near-infrared heating welding device 'HB-1390'

Cut the rotation and slide functions of the work! There is almost no decrease in output, and adjustments due to the passage of time are unnecessary.

The HB-1390 is a device that enables heating processing in the range of 1 to 5 mm through a combination of a line heater with linear light collection and a light-shielding mask. The condition settings are limited to three points: output, irradiation time, and light-shielding mask width adjustment. It is easy to operate and has high quality reproducibility that does not rely on the operator's skill level. We have a test machine in our lab, so please feel free to consult us if you wish to conduct a test. 【Features】 ■ Almost no output decrease, eliminating the need for condition adjustments over time ■ Only three condition settings (output, irradiation time, light-shielding mask width adjustment) ■ High quality reproducibility that does not depend on the operator's skill level ■ Welding is possible without rotating the workpiece *For more details, please refer to the PDF document or feel free to contact us.

  • Heating device
  • Other heaters

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Adfos NIR: Super Near-Infrared Heating Device

Dramatically reduces heating processing time across a wide range of industries, from resin and film to metal. The conventional time requirement is reduced to less than 1/10!

Adfos NIR (Near Infrared) is a German-made ultra-near-infrared heating device that possesses wavelength characteristics distinct from conventional infrared. While the wavelength range of typical near-infrared is 1.2 to 2μm (peak wavelength: 1.2μm), the wavelength range of Adfos NIR is 0.8 to 1.5μm (peak wavelength: 0.85μm). One of the features of this wavelength range is its high absorption for metals, providing very strong heating power, while also having high transmittance for heat-sensitive substrates such as paper, resin films, and glass. This minimizes thermal damage to these substrates and allows for the instantaneous drying and firing of printed/coated materials (such as conductive/insulating inks). It is indeed a technology that has the potential to solve challenges in the currently competitive global development of printed electronics (PE). Furthermore, due to its high energy density and powerful heating, it can rapidly reach target temperatures in applications where other heating methods take time to heat up (such as metal heat treatment and solder reflow), significantly reducing traditional processing times and enabling the downsizing of equipment through shorter furnace lengths.

  • Other heaters
  • Other FA equipment

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